SAA7324H NXP Semiconductors, SAA7324H Datasheet - Page 65

SAA7324H

Manufacturer Part Number
SAA7324H
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SAA7324H

Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAA7324H
Manufacturer:
PHILIPS
Quantity:
84
Part Number:
SAA7324H/M2B,557
Manufacturer:
NXP Semiconductors
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Part Number:
SAA7324H/T/M2B
Manufacturer:
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Part Number:
SAA7324H/T/M2B
Manufacturer:
PHILIPS/飞利浦
Quantity:
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Philips Semiconductors
15.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2000 Jun 26
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Digital servo processor and Compact Disc
decoder with integrated DAC (CD10 II)
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
not suitable
suitable
not recommended
not recommended
(2)
WAVE
65
(3)(4)
(5)
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
SAA7324
(1)

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