SAA7324H NXP Semiconductors, SAA7324H Datasheet - Page 66

SAA7324H

Manufacturer Part Number
SAA7324H
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SAA7324H

Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAA7324H
Manufacturer:
PHILIPS
Quantity:
84
Part Number:
SAA7324H/M2B,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
SAA7324H/T/M2B
Manufacturer:
NXP
Quantity:
5 000
Part Number:
SAA7324H/T/M2B
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
16 DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
17 DEFINITIONS
Short-form specification
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
19 PURCHASE OF PHILIPS I
2000 Jun 26
Objective specification
Preliminary specification
Product specification
DATA SHEET STATUS
Digital servo processor and Compact Disc
decoder with integrated DAC (CD10 II)
Purchase of Philips I
components in the I
Philips. This specification can be ordered using the code 9398 393 40011.
Development
Qualification
Production
Applications that are
The data in a short-form
PRODUCT
Limiting values given are in
STATUS
2
C COMPONENTS
2
C system provided the system conforms to the I
2
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
C components conveys a license under the Philips’ I
66
18 DISCLAIMERS
Life support applications
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
DEFINITIONS
(1)
Philips Semiconductors
2
C specification defined by
These products are not
2
C patent to use the
Product specification
SAA7324

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