GCIXP1200GB Intel, GCIXP1200GB Datasheet - Page 144
![no-image](/images/manufacturer_photos/0/3/336/intel_sml.jpg)
GCIXP1200GB
Manufacturer Part Number
GCIXP1200GB
Description
IC MPU NETWORK 200MHZ 432-BGA
Manufacturer
Intel
Specifications of GCIXP1200GB
Rohs Status
RoHS non-compliant
Processor Type
Network
Features
32-bit StrongARM RISC Core
Speed
200MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
432-BGA
Mounting
Surface Mount
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Other names
839428
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GCIXP1200GB
Manufacturer:
ERICSSON
Quantity:
22
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Intel
8.2
144
Table 53. IXP1200 Package Dimensions (mm)
®
IXP1200 Network Processor
IXP1200 Package Dimensions (mm)
A
A
A
D
D
E
E
b
aaa
bbb
ccc
ddd [8]
P
S
M, N
M1[7]
d
e
NOTES:
10.The dimension from the outer edge of the resin dam to the edge of the innermost row of the solder ball
1. All dimensions and tolerances conform to ANSI Y1.45M-1982.
2. Dimension “b” is measured at the maximum solder ball diameter parallel to primary datum “c”.
3. Primary datum “c” and seating plane are defined by the spherical crowns of the solder balls.
4. Pin A1 I.D. marked by ink.
5. Shape at corner, single form.
6. All dimensions are in millimeters.
7. Number of rows in from edge to center.
8. Height from ball seating plane to plane of encapsulant.
9. S is measured with respect to -A- and -B- and defines the position of the center solder ball in the outer row.
1
2
1
1
When there is an odd number of solder balls in the outer row, S=0.000; when there is an even number of
solder balls in the outer row, the value S=e/2. S can be either 0.000 or e/2 for each variation.
pads is to be a minimum of 0.50 mm.
Symbol
Overall thickness
Ball height
Body thickness
Body size
Ball footprint
Body size
Ball footprint
Ball diameter
Coplanarity
Parallel
Top flatness
Seating plane clearance
Encapsulation height
Solder ball placement
Ball matrix
Number of rows deep
Minimum distance, encap to balls
Ball pitch
Definition
1.41
0.56
0.85
39.90
38.00
39.90
38.00
0.60
--
--
--
0.15
0.20
--
--
--
--
--
Minimum
1.54
0.63
0.91
40.00
38.10
40.00
38.10
0.75
--
--
--
0.33
0.30
--
31 x 31
4
0.6
1.27
Nominal
1.67
0.97
40.10
40.10
0.90
0.20
0.20
0.50
0.35
0.00
--
--
--
0.70
38.20
38.20
0.15
--
Maximum
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