MPC8560CPX667JC Freescale Semiconductor, MPC8560CPX667JC Datasheet - Page 53

IC MPU PWRQUICC III 783-FCPBGA

MPC8560CPX667JC

Manufacturer Part Number
MPC8560CPX667JC
Description
IC MPU PWRQUICC III 783-FCPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIIr
Datasheets

Specifications of MPC8560CPX667JC

Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, MII, SPI, TDM, UTOPIA
Digital Ic Case Style
BGA
No. Of Pins
783
Rohs Compliant
No
Family Name
MPC85XX
Device Core
PowerQUICC III
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
783
Package Type
FCBGA
For Use With
MPC8560ADS-BGA - BOARD APPLICATION DEV 8560
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8560CPX667JC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
11.2 I
Table 41
Figure 16
Freescale Semiconductor
All values refer to V
SCL clock frequency
Low period of the SCL clock
High period of the SCL clock
Setup time for a repeated START condition
Hold time (repeated) START condition (after this period, the
first clock pulse is generated)
Data setup time
Data hold time:
Set-up time for STOP condition
Bus free time between a STOP and START condition
Noise margin at the LOW level for each connected device
(including hysteresis)
Noise margin at the HIGH level for each connected device
(including hysteresis)
Notes:
1.The symbols used for timing specifications herein follow the pattern of t
2.MPC8560 provides a hold time of at least 300 ns for the SDA signal (referred to the V
3.The maximum t
4.C
6.Guaranteed by design.
B
(reference)(state)
symbolizes I
clock reference (K) going to the high (H) state or setup time. Also, t
the data with respect to the start condition (S) went invalid (X) relative to the t
(L) state or hold time. Also, t
condition (P) reaching the valid state (V) relative to the t
time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
the undefined region of the falling edge of SCL.
= capacitance of one bus line in pF.
2
provides the AC timing parameters for the I
C AC Electrical Specifications
provides the AC test load for the I
IH
(min) and V
2
I2DVKH
C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the t
for inputs and t
Output
Parameter
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
has only to be met if the device does not stretch the LOW period (t
IL
(max) levels (see
I2PVKH
CBUS compatible masters
(first two letters of functional block)(reference)(state)(signal)(state)
Table 41. I
symbolizes I
Figure 36. I
Table
I
2
Z
C bus devices
0
2
= 50 Ω
C AC Electrical Specifications
40).
2
C.
2
C timing (I2) for the time that the data with respect to the stop
2
C AC Test Load
2
I2C
C interface of the MPC8560.
Symbol
t
t
t
t
clock reference (K) going to the high (H) state or setup
I2SVKH
I2DVKH
t
I2SXKL
t
I2PVKH
t
t
I2KHDX
I2DXKL
I2CH
I2CL
V
V
f
I2C
NH
NL
6
6
I2SXKL
6
6
6
1
(first two letters of functional block)(signal)(state)
R
L
= 50 Ω
symbolizes I
0.1 × OV
0.2 × OV
I2C
Min
100
1.3
0.6
0.6
0.6
0.6
1.3
0
0
clock reference (K) going to the low
2
IHmin
for outputs. For example, t
DD
DD
OV
2
C timing (I2) for the time that
DD
I2CL
of the SCL signal) to bridge
/2
) of the SCL signal.
0.9
Max
400
3
Unit
I2DVKH
kHz
μs
μs
μs
μs
ns
μs
μs
μs
V
V
I2C
I2C
53

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