PCX8240VTPU200EZD3 Atmel, PCX8240VTPU200EZD3 Datasheet

no-image

PCX8240VTPU200EZD3

Manufacturer Part Number
PCX8240VTPU200EZD3
Description
IC MPU 32BIT 200MHZ 352TBGA
Manufacturer
Atmel
Datasheet

Specifications of PCX8240VTPU200EZD3

Processor Type
PowerPC 603e 32-Bit RISC
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
352-TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PCX8240VTPU200EZD3
Manufacturer:
Atmel
Quantity:
10 000
Features
Description
The PC8240 combines a PowerPC
PC8240’s PCI support will allow system designers to rapidly design systems using peripherals
already designed for PCI and the other standard interfaces. The PC8240 also integrates a high-
performance memory controller which supports various types of DRAM and ROM. The PC8240
is the first of a family of products that provides system level support for industry standard inter-
faces with a PowerPC microprocessor core.
The peripheral logic integrates a PCI bridge, memory controller, DMA controller, EPIC interrupt
controller, I
high-performance processor with floating-point support, memory management, 16-Kbyte
instruction cache, 16-Kbyte data cache, and power management features. The integration
reduces the overall packaging requirements and the number of discrete devices required for an
embedded system.
The PC8240 contains an internal peripheral logic bus that interfaces the 603e core to the
peripheral logic. The core can operate at a variety of frequencies, allowing the designer to trade
off performance for power consumption. The 603e core is clocked from a separate PLL, which
is referenced to the peripheral logic PLL. This allows the microprocessor and the peripheral
logic block to operate at different frequencies, while maintaining a synchronous bus interface.
The interface uses a 64- or 32-bit data bus (depending on memory data bus width) and a 32-bit
address bus along with control signals that enable the interface between the processor and
peripheral logic to be optimized for performance. PCI accesses to the PC8240’s memory space
are passed to the processor bus for snooping purposes when snoop mode is enabled.
The PC8240’s features serve a variety of embedded applications. In this way, the 603e core
and peripheral logic remain general-purpose. The PC8240 can be used as either a PCI host or
an agent controller.
Screening/Quality/Packaging
This product is manufactured in full compliance with:
6.6 SPEC int 95, 5.5 SPECfp95 at 266 MHz (Estimated)
Superscalar 603e Core
Integer Unit (IU), Floating-Point Unit (FPU) (User Enabled or Disabled), Load/Store Unit
(LSU), System Register Unit (SRU), and a Branch Processing Unit (BPU)
16-Kbyte Instruction Cache
16-Kbyte Data Cache
Lockable L1 Caches - Entire Cache or on a Per-way Basis up to 3 of 4 Ways
Dynamic Power Management
High-bandwidth Bus (32/64 bits Data Bus) to DRAM
Supports 1-Mbyte to 1-Gbyte DRAM Memory
32-bit PCI Interface Operating up to 66 MHz
PCI 2.1-compliant, 5.0V Tolerance
Fint Max = 200 MHz
FBus Max = 66 MHz
(T
(T
2.5 ± 5 % V (L-Spec for 200 MHz)
Upscreening based upon Atmel standards
Industrial temperature range
Core power supply:
I/O power supply: 3.0V to 3.6V
352 Tape Ball Grid Array (TBGA)
c
c
= -40°C, T
= -40°C, T
2
O controller, and a two-wire interface controller. The 603e core is a full-featured,
c
c
= +110 C)
= +125 C): ZD3 suffix
603e core microprocessor with a PCI bridge. The
Tape Ball Grid Array
TBGA352
TP suffix
Integrated
Processor
Family
PC8240
Rev. 2149A–HIREL–05/02
1

Related parts for PCX8240VTPU200EZD3

PCX8240VTPU200EZD3 Summary of contents

Page 1

... The PC8240’s features serve a variety of embedded applications. In this way, the 603e core and peripheral logic remain general-purpose. The PC8240 can be used as either a PCI host or an agent controller. Screening/Quality/Packaging This product is manufactured in full compliance with: • Upscreening based upon Atmel standards • Industrial temperature range (T = -40° +110 C) ...

Page 2

General Description Block Diagram Figure 1. Block Diagram PC8240 Additional features: • JTAG/COP interface • Power management I2C 5 IRQs/ 16 Serial Interrupts PC8240 2 The PC8240 integrated processor is comprised of a peripheral logic block and a 32-bit superscalar ...

Page 3

Pinout Listing Table 1. PC8240 Pinout Listing Signal Name Package Pin Number PCI Interface Signals – C/BE[0 3] A25 F23 K23 P25 DEVSEL H26 FRAME J24 IRDY K25 LOCK J26 – AD[0 31] C22 D22 B22 B23 D19 B24 A24 ...

Page 4

Table 1. PC8240 Pinout Listing (Continued) Signal Name Package Pin Number – SDMA[ SDMA12/SDBA1 P1 SDBA0 P2 – PAR[0 7] AF3 AE3 G4 E2 AE4 AF4 D2 ...

Page 5

Table 1. PC8240 Pinout Listing (Continued) Signal Name Package Pin Number TBEN B14 QACK/DA0 F2 CHKSTOP_IN D14 – MAA[0 2] AF2 AF1 AE1 MIV A16 – PMAA[0 2] AD18 AF18 AE19 Test/Configuration Signals – PLL_CFG[0 4]/ A22 B19 A21 B18 ...

Page 6

Table 1. PC8240 Pinout Listing (Continued) Signal Name Package Pin Number AVdd C17 AVdd2 AF24 Manufacturing Pins DA2 C25 – DA[11 13] AD26 AF17 AF19 – DA[14 15 Notes: 1. Place pull-up resistors of 120 or less on ...

Page 7

... Ratings 2149A–HIREL–05/02 This drawing describes the specific requirements for the PC8240 processor, in compli- ance with Atmel standard screening. 1. MIL-STD-883: Test methods and procedures for electronics. 2. MIL-PRF-38535: General specifications for microcircuits. The microcircuits are in accordance with the applicable documents and as specified herein. The terminal connections are shown in Table 1, “ ...

Page 8

Recommended Operating Conditions Table 3. Recommended Operating Conditions (1) Symbol Characteristic Vdd Supply Voltage OVdd I/O Buffer supply for PCI and Standard GVdd Supply Voltages for Memory Bus Drivers AVdd PLL Supply Voltage – CPU Core Logic PLL Supply Voltage ...

Page 9

Figure 2. Supply Voltage Sequencing and Separation Cautions 5V 3.3V 2.5V 0 Voltage Regulator Delay Reset Configuration Pins HRST_CPU & HRST_CTRL Notes: 1. Numbers associated with waveform separations correspond to caution numbers listed in Table 3, “Recommended Operat- ing Conditions,” ...

Page 10

Thermal Information Thermal Characteristics Thermal Management Information PC8240 10 Figure 3 shows the undershoot and overshoot voltage of the memory interface of the PC8240. Figure 3. Overshoot/Undershoot Voltage 4V GVdd + 5% GVdd VIH Gnd Gnd ± 0.3V VIL Gnd ...

Page 11

Figure 5 depicts the die junction-to-ambient thermal resistance for four typical cases heat sink is not attached to the TBGA package and there exists high board- level thermal loading of adjacent components heat sink is ...

Page 12

Internal Package Conduction Resistance PC8240 12 The board designer can choose between several types of heat sinks to place on the PC8240. There are several commercially-available heat sinks for the PC8240 provided by the following vendors: Chip Coolers Inc. 333 ...

Page 13

Adhesives and Thermal Interface Materials 2149A–HIREL–05/02 A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism, Figure 7 shows ...

Page 14

Heat Sink Selection Example PC8240 14 The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements. There are several ...

Page 15

Power Consideration Table 5. Preliminary Power Consumption Mode 33/66/166 Typical 2.5 Max – FP 3.0 Max – INT 2.7 Doze 1.8 Nap 700 Sleep 500 Mode Typ – OVdd Typ – GVdd Notes: 1. The values include Vdd, AVdd, AVdd2, ...

Page 16

... PC8240 16 The document where markings are defined is identified in the related reference docu- ments. Each microcircuit is legible and permanently marked with the following information as minimum: • Atmel Logo, • Manufacturer’s part number,Date-code of inspection lot, • ESD identifier if available, • Country of manufacturing. ...

Page 17

See Table 7 on page 17 for the typical drive capability of a specific signal pin based upon the type of output driver associ- ated with that pin as listed in. 4. These specifications are for the default driver ...

Page 18

Dynamic Electrical Characteristics Clock AC Specifications Table 9. Clock AC Timing Specifications Num Characteristics and Conditions 1a Frequency of Operation (PCI_SYNC_IN) 1b PCI_SYNC_IN Cycle Time 2, 3 PCI_SYNC_IN Rise and Fall Times 4 PCI_SYNC_IN Duty Cycle Measured at 1.4V 5a ...

Page 19

Table 9. Clock AC Timing Specifications (Continued) Num Characteristics and Conditions 18 OSC_IN Cycle Time 19 OSC_IN Rise and Fall Times 20 OSC_IN Duty Cycle Measured at 1.4V 21 OSC_IN Frequency Stability 22 OSC_IN V (Loaded OSC_IN V ...

Page 20

Figure 9. DLL Locking Range Loop Delay vs. Frequency of Operation 25 MHz MHz MHz 20 ns 100 MHz Input AC Timing Specifications Table 10. Input AC Timing Specifications Num ...

Page 21

All PCI signals are measured from OVdd/2 of the rising edge of PCI_SYNC_IN to 0.4*OVdd of the signal in question for 3.3V PCI signaling levels. See Figure 11. 3. Input timings are measured at the pin ...

Page 22

Output AC Timing Specification Table 11. Output AC Timing Specifications (3)(6) Num Characteristics 12a PCI_SYNC_IN to Output Valid, 66 MHz PCI, with MCP pulled-down to logic 0 state. See Figure 14. PCI_SYNC_IN to Output Valid, 33 MHz PCI, with MCP ...

Page 23

PCI Signal Output Hold Timing Table 12. Power Management Configuration Register 2-0x72 Bit Name Reset value 6–4 PCI_HOLD_DEL xx0 2149A–HIREL–05/02 Figure 13. AC Test Load for the PC8240 OUTPUT Z0 = 50Ω PIN In order to meet minimum output hold ...

Page 24

Figure 14. PCI_HOLD_DEL Affect on Output Valid and Hold Time PCI_SYNC_IN 12a for 33 MHz PCI PCI_HOLD_DEL = 100 PCI INPUTS/OUTPUTS 33 MHz PCI 12a for 66 MHz PCI PCI_HOLD_DEL = 000 PCI INPUTS/OUTPUTS 66 MHz ...

Page 25

Table 13. Two-wire Interface Input AC Timing Specifications (Continued) Num Characteristics 6 Clock high period (Time needed to either receive a data bit or generate a START or STOP.) 7 Data setup time 8 Start condition setup time (for repeated ...

Page 26

Table 14. PC8240 Maximum Two-wire Interface Input Frequency (Continued) (2) FDR Hex 14, 15 16, 17, 3A, 3B, 3C, 3D 12288, 14336, 15360, 16384, 20480, 24576 18, 19 1A, 1B, 3E, 3F 24576, 28672, 30720, 1C, 1D 1E, 1F Notes: ...

Page 27

Specified at a nominal 50 pF load the decimal divider number indexed by FDR[5:0] value. Refer to the FDR Bit Clock Frequency Divider Selections table. FDR[x] refers to the Frequency Divider Register I2CFDR bit x. N ...

Page 28

Figure 18. Two-wire Interface Timing Diagram IV (Qualified signal) VM SCL/SDArealtime (1) Delay SCL/SDAqualified Note 1: The delay is the Local Memory clock times DFFSR times 2 plus 1 Local Memory clock. EPIC Serial Interrupt Mode AC Timing Specifications Table ...

Page 29

Figure 19. EPIC Serial Interrupt Mode Output Timing Diagram VM sys_logic_clk3 S_CLK S_FRAME S_RST Figure 20. EPIC Serial Interrupt Mode Input Timing Diagram S_CLK S_INT IEEE 1149.1 (JTAG) AC Timing Specifications 2149A–HIREL–05/ ...

Page 30

PC8240 30 Table 17. JTAG AC Timing Specifications (Independent of PCI_SYNC_IN) (4) Num Characteristics 10 TMS, TDI Data Setup Time 11 TMS, TDI Data Hold Time 12 TCK to TDO Data Valid 13 TCK to TDO High Impedance Notes: 1. ...

Page 31

... TDO TDO Microcircuits are prepared for delivery in accordance with MIL-PRF-38535. Atmel offers a certificate of compliance with each shipment of parts, affirming the prod- ucts are in compliance either with MIL-STD-883 and guaranteeing the parameters not tested at temperature extremes for the entire temperature range. MOS devices must be handled with certain precautions to avoid damage due to accu- mulation of static charge ...

Page 32

Package Description Package Parameters PC8240 32 The PC8240 uses mm, cavity down, 352 pin Tape Ball Grid Array (TBGA) package. The package parameters are as provided in the following list. Table 18. Package Parameters Parameter ...

Page 33

Mechanical Dimensions Figure 25. PC8240 Package Dimensions and Pinout Assignments - F - CORNER ...

Page 34

PLL Configuration Table 19. PC8240 Microprocessor PLL Configuration PLL_ CFG CPU HID1 (1)(3) Ref [0 – – 00000 00110 1 00001 TBD 2 00010 TBD 3 00011 TBD 4 00100 00101 5 00101 TBD 7 00111 ...

Page 35

In Clock Off mode, no clocking occurs inside the PC8240 regardless of the PCI_SYNC_IN input. 6. Limited due to maximum memory VCO = 225 MHz. 7. Limited due to minimum CPU VCO = 200 MHz. 8. Limited due to ...

Page 36

Figure 27. Example Voltage Sequencing Circuits + 5V Source + 3.3V Source + 2.5V Source Power Supply Sizing Decoupling Recommendations Connection Recommendations PC8240 3.3V + 2.5V The power consumption numbers provided in Table do ...

Page 37

Pull-up/Pull-down Resistor Requirements 2149A–HIREL–05/02 The SDRAM_SYNC_OUT signal is intended to be routed halfway out to the SDRAM devices and then returned to the SDRAM_SYNC_IN input of the PC8240. The trace length may be used to skew or adjust the timing ...

Page 38

JTAG Configuration Signals PC8240 38 Boundary scan testing is enabled through the JTAG interface signals. (BSDL descrip www.mot.com/SPS/PowerPC/teksupport/tools/BSDL/) The TRST signal is optional in ...

Page 39

Figure 28. COP Connector Diagram From Target Board Sources (if only Key 13 No pin 15 16 COP Connector Physical Pin Out Notes: 1. QACK is an output ...

Page 40

... These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Atmel customers using or selling these products for use in such applications their own risk and agree to fully indemnify Atmel for any damages resulting from such improper use or sale. Validity ...

Page 41

... Ordering Information Type (PCX8240 if prototype) Temperature Range -40°C, +110°C Package TP: TBGA Note: 1. For availability of the different versions, contact your ATMEL sale office. 2149A–HIREL–05/02 Table 21. Differences with commercial part Commercial Part Temperature range 105°C Power consumption Spec 13a (output hold) ...

Page 42

... No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. ...

Related keywords