PIC12F683-I/SN Microchip Technology Inc., PIC12F683-I/SN Datasheet - Page 165

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PIC12F683-I/SN

Manufacturer Part Number
PIC12F683-I/SN
Description
8 PIN, 3.5 KB FLASH, 128 RAM, 6 I/O
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC12F683-I/SN

A/d Inputs
4-Channel, 10-Bit
Comparators
1
Cpu Speed
5 MIPS
Eeprom Memory
256 Bytes
Input Output
5
Memory Type
Flash
Number Of Bits
8
Package Type
8-pin SOIC-N
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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PIC12F683-I/SN
0
8-Lead Plastic Dual-Flat, No-Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated
© 2006 Microchip Technology Inc.
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: Pending
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent MO-220
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
See ASME Y14.5M
See ASME Y14.5M
n
1
TOP VIEW
2
E1
E
Dimension Limits
A2
D1
Units
E2
D2
A2
A3
D1
E1
A1
E
D
B
R
n
p
A
L
A3
D
MIN
A
.000
.152
.085
.014
.020
.008 REF.
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
INCHES
NOM
.0004
EXPOSED
.033
.026
.158
.016
.024
.014
.091
METAL
PADS
8
MAX
R
.002
.163
.097
.030
.039
.019
.031
12°
B
BOTTOM VIEW
MIN
0.00
3.85
2.16
0.35
0.50
MILLIMETERS*
E2
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
p
PIC12F683
Revised 07-19-05
0.85
0.65
4.00
0.40
0.60
.356
0.01
2.31
8
PIN 1
INDEX
L
DS41211C-page 163
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
D2
12°

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