GC80960RD66 Intel, GC80960RD66 Datasheet - Page 30

• Manufacturer Part Number: GC80960RD66
• Manufacturer: Intel

Specifications of GC80960RD66

• Family Name: i960 RX
• Device Core: 80960
• Device Core Size: 32b
• Frequency (max): 66MHz
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: HLBGA
• Lead Free Status / Rohs Status: Not Compliant

Intel
Package Information
3.1.2
Figure 3.
30
®
i960
®
RX I/O Processor at 3.3 Volts
352-Lead HL-PBGA Package
352L HL-PBGA Package Diagram (Top and Side View)
Ball A1 Corner
NOTES:
1. All dimensions and tolerances conform to ANSI Y14.5M 1982.
2. All dimensions are in millimeters.
3. Tin/Lead mix: 63%/37%.
4. Pad plating method: Electrolytic.
5. Encapsulant size: 22.38 x 22.38 mm (max).
0.63 ± 0.07 mm
1.54 ± 0.13 mm
1.63 mm
Ball width is 0.75 ± 0.15 mm
Ball spacing is 1.27 mm
i
i960
GC80960RxZZ
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35 ± 0.10 mm
Ball Footprint
Body Size
31.75 mm
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Package Height
35 ± 0.10 mm
0.91 ± 0.06 mm
Datasheet