PI7C8150BND Pericom Semiconductor, PI7C8150BND Datasheet - Page 102

• Manufacturer Part Number: PI7C8150BND
• Manufacturer: Pericom Semiconductor

Specifications of PI7C8150BND

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 85C
• Package Type: BGA
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

17.5
17.6
18
18.1
33MHZ TIMING
POWER CONSUMPTION
PACKAGE INFORMATION
208-PIN FQFP PACKAGE DIAGRAM
Symbol
T
T
T
T
T
Parameter
Power Consumption at 66MHz
Supply Current, I
SKEW
DELAY
CYCLE
HIGH
LOW
Parameter
SKEW among S_CLKOUT[9:0]
DELAY between PCLK and S_CLKOUT[9:0]
P_CLK, S_CLKOUT[9:0] cycle time
P_CLK, S_CLKOUT[9:0] HIGH time
P_CLK, S_CLKOUT[9:0] LOW time
Figure 18-1. 208-pin FQFP Package Outline
CC
92
Typical
1.39
420
Condition
20pF load
March 19, 2003 – Revision 1.04
2-PORT PCI-TO-PCI BRIDGE
ADVANCE INFORMATION
Min.
0
4.6
30
11
11
Units
W
mA
Max.
0.250
5.5
PI7C8150
Units
ns