AT32UC3L064 Atmel Corporation, AT32UC3L064 Datasheet - Page 73

• Manufacturer Part Number: AT32UC3L064
• Manufacturer: Atmel Corporation

Specifications of AT32UC3L064

• Flash (kbytes): 64 Kbytes
• Pin Count: 48
• Max. Operating Frequency: 50 MHz
• Cpu: 32-bit AVR
• # Of Touch Channels: 17
• Hardware Qtouch Acquisition: Yes
• Max I/o Pins: 36
• Ext Interrupts: 36
• Usb Speed: No
• Usb Interface: No
• Spi: 5
• Twi (i2c): 2
• Uart: 4
• Lin: 4
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 8
• Adc Resolution (bits): 12
• Adc Speed (ksps): 460
• Analog Comparators: 8
• Resistive Touch Screen: No
• Temp. Sensor: Yes
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: YES
• Dram Memory: No
• Nand Interface: No
• Picopower: Yes
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.62 to 3.6
• Operating Voltage (vcc): 1.62 to 3.6
• Fpu: No
• Mpu / Mmu: Yes / No
• Timers: 6
• Output Compare Channels: 18
• Input Capture Channels: 12
• Pwm Channels: 35
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32099G–06/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
Table
42.
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
8-1.
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
JA
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
AT32UC3L016/32/64
TLLGA48
TLLGA48
Package
TQFP48
TQFP48
QFN48
QFN48
Section 7.5 on page
Table
30.06
63.2
21.8
28.3
TBD
Typ
2.5
8-1.
J
°C/W
°C/W
°C/W
in °C.
Unit
73