SAM7X512 Atmel Corporation, SAM7X512 Datasheet - Page 13
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SAM7X512
Manufacturer Part Number
SAM7X512
Description
Manufacturer
Atmel Corporation
Specifications of SAM7X512
Flash (kbytes)
512 Kbytes
Pin Count
100
Max. Operating Frequency
55 MHz
Cpu
ARM7TDMI
Hardware Qtouch Acquisition
No
Max I/o Pins
62
Ext Interrupts
62
Usb Transceiver
1
Usb Speed
Full Speed
Usb Interface
Device
Spi
2
Twi (i2c)
1
Uart
3
Can
1
Ssc
1
Ethernet
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
128
Self Program Memory
NO
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.3
Operating Voltage (vcc)
3.0 to 3.6
Fpu
No
Mpu / Mmu
no / no
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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6. I/O Lines Considerations
6.1
6.2
6.3
6.4
6120I–ATARM–06-Apr-11
JTAG Port Pins
Test Pin
Reset Pin
ERASE Pin
TMS, TDI and TCK are schmitt trigger inputs and are not 5-V tolerant. TMS, TDI and TCK do not
integrate a pull-up resistor.
TDO is an output, driven at up to VDDIO, and has no pull-up resistor.
The JTAGSEL pin is used to select the JTAG boundary scan when asserted at a high level. The
JTAGSEL pin integrates a permanent pull-down resistor of about 15 kΩ to GND.
To eliminate any risk of spuriously entering the JTAG boundary scan mode due to noise on
JTAGSEL, it should be tied externally to GND if boundary scan is not used, or pulled down with
an external low-value resistor (such as 1 kΩ) .
T h e T S T p i n i s u s e d f o r m a n u f a c t u r i n g t e s t o r f a s t p r o g r a m m i n g m o d e o f t h e
SAM7X512/256/128 when asserted high. The TST pin integrates a permanent pull-down resis-
tor of about 15 kΩ to GND.
To eliminate any risk of entering the test mode due to noise on the TST pin, it should be tied to
GND if the FFPI is not used, or pulled down with an external low-value resistor (such as 1 kΩ)
To enter fast programming mode, the TST pin and the PA0 and PA1 pins should be tied high
and PA2 tied to low.
Driving the TST pin at a high level while PA0 or PA1 is driven at 0 leads to unpredictable results.
The NRST pin is bidirectional with an open drain output buffer. It is handled by the on-chip reset
controller and can be driven low to provide a reset signal to the external components or asserted
low externally to reset the microcontroller. There is no constraint on the length of the reset pulse,
and the reset controller can guarantee a minimum pulse length. This allows connection of a sim-
ple push-button on the NRST pin as system user reset, and the use of the signal NRST to reset
all the components of the system.
The NRST pin integrates a permanent pull-up resistor to VDDIO.
The ERASE pin is used to re-initialize the Flash content and some of its NVM bits. It integrates a
permanent pull-down resistor of about 15 kΩ to GND.
To eliminate any risk of erasing the Flash due to noise on the ERASE pin, it shoul be tied exter-
nally to GND, which prevents erasing the Flash from the applicatiion, or pulled down with an
external low-value resistor (such as 1 kΩ) .
This pin is debounced by the RC oscillator to improve the glitch tolerance. When the pin is tied to
high during less than 100 ms, ERASE pin is not taken into account. The pin must be tied high
during more than 220 ms to perform the re-initialization of the Flash.
SAM7X512/256/128
13
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