SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 92
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SAM9M10
Manufacturer Part Number
SAM9M10
Description
Manufacturer
Atmel Corporation
Datasheets
1.M40800.pdf
(284 pages)
2.SAM9261.pdf
(248 pages)
3.SAM9M10.pdf
(59 pages)
4.SAM9M10.pdf
(1398 pages)
Specifications of SAM9M10
Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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Memory Interface
3-22
ARM7TDMI core test chip example system
Connecting the ARM7TDMI processor data bus, D[31:0] to an external shared bus
requires additional logic that varies between applications in the case of a test chip.
In this application, care must be taken to prevent bus clash on D[31:0] when the data
bus drive changes direction. The timing of nENIN, and the pad control signals must be
arranged so that when the core starts to drive out, the pad drive onto D[31:0] is disabled
before the core starts to drive. Similarly, when the bus switches back to input, the core
must stop driving before the pad is enabled.
The circuit implemented in the ARM7TDMI processor test chip is shown in Figure 3-17
on page 3-23.
Copyright © 1994-2001. All rights reserved.
ARM DDI 0029G
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