ST7263BK1 STMicroelectronics, ST7263BK1 Datasheet - Page 171

• Manufacturer Part Number: ST7263BK1
• Description: LOW SPEED USB 8-BIT MCU FAMILY WITH UP TO 32K FLASH/ROM, DFU CAPABILITY, 8-BIT ADC, WDG, TIMER, SCI and I2C
• Manufacturer: STMicroelectronics

Specifications of ST7263BK1

• 4, 8, 16 Or 32 Kbytes Program Memory: high density Flash (HDFlash), FastROM or ROM with Read-Out and Write protection

ST7263Bxx
14.2
14.3
Thermal characteristics
Table 85.
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering and glueability information
Recommended glue for SMD plastic packages dedicated to molding compound with
silicone:
●
●
of an application can be defined by the user with the formula: P
internal power (I
application.
Heraeus: PD945, PD955
Loctite: 3615, 3298
Symbol
T
R
P
Jmax
thJA
D
Thermal characteristics
DD
x V
Package thermal resistance (junction to
ambient)
SDIP32
LQFP48
QFN40
Power dissipation
Maximum junction temperature
SO34
SO24
DD
) and P
PORT
Doc ID 7516 Rev 8
the port power dissipation depending on the ports used in the
(1)
Ratings
(2)
D
D
=P
= (T
INT
J
-T
+ P
A
) / R
PORT
Package characteristics
thJA
where P
. The power dissipation
Value
500
150
60
75
70
80
34
INT
is the chip
°C/W
171/186
Unit
mW
°C