S1D10605 Epson Electronics America, Inc., S1D10605 Datasheet - Page 29

• Manufacturer Part Number: S1D10605
• Description: S1d15000 Series Lcd Driver With Ram
• Manufacturer: Epson Electronics America, Inc.

S1D15200 Series
5. PAD
Pad Layout
Chip specifications of AL pad package
Chip size: 4.80 7.04 0.400 mm
Pad pitch: 100 100 m
Note: An example of S1D15200D10A
2–4
package.
1
5
10
15
20
25
30
100
35
*
95
die numbers is given. These numbers are the same as the bump
(0, 0)
4.80 mm
Y
40
EPSON
90
Chip specifications of gold bump package
Chip size:
Bump pitch: 199 m (Min.)
Bump height: 22.5 m (Typ.)
Bump size:
X
45
85
50
80
75
70
65
60
55
4.80 7.04 0.525 mm
132 111 m ( 20 m) for mushroom
model
116 92 m ( 4 m) for vertical model
Rev. 1.1