DSPIC33FJ64MC508 Microchip Technology Inc., DSPIC33FJ64MC508 Datasheet - Page 329

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DSPIC33FJ64MC508

Manufacturer Part Number
DSPIC33FJ64MC508
Description
High-performance, 16-bit Digital Signal Controllers
Manufacturer
Microchip Technology Inc.
Datasheet

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© 2007 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
dsPIC33FJXXXMCX06/X08/X10 MOTOR CONTROL FAMILY
1 2 3
D
D1
Dimension Limits
NOTE 2
E1
φ
L
Units
D1
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
Microchip Technology Drawing C04-110B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
DS70287A-page 327
A2
α

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