MSC8144 Freescale Semiconductor, MSC8144 Datasheet - Page 28

• Manufacturer Part Number: MSC8144
• Description: Quad Core Digital Signal Processor
• Manufacturer: Freescale Semiconductor

Electrical Characteristics
2.4
Table 5 describes thermal characteristics of the MSC8144 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
2.5
The estimated typical power dissipation for MSC8144 versus the core frequency is shown in Table 6.
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Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Notes:
Note:
Extended Core Frequency
1.
2.
3.
4.
5.
Measured for 1.0 V core at 25°C junction temperature.
Thermal Characteristics
Power Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
5
1, 2
266
333
400
500
Characteristic
4
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
1, 3
Table 5. Thermal Characteristics for the MSC8144
Table 6. Power Dissipation
Core Frequency
1000
1000
1000
400
533
667
800
500
667
833
400
600
800
500
750
Symbol
R
R
R
R
θJA
θJA
θJB
θJC
Convection
Natural
0.8
20
15
7
Typical
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29
FC-PBGA
×
29 mm
(1 m/s) airflow
200 ft/min
5
Freescale Semiconductor
15
12
Unit
W
W
W
W
°C/W
°C/W
°C/W
°C/W
Unit