MSC8144 Freescale Semiconductor, MSC8144 Datasheet - Page 76

• Manufacturer Part Number: MSC8144
• Description: Quad Core Digital Signal Processor
• Manufacturer: Freescale Semiconductor

Ordering Information
3.5
An estimation of the chip-junction temperature
where
The power dissipation values for the MSC8144 are listed in Table 5. The ambient temperature for the device is the
air temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances
are JEDEC standard values that provide a quick and easy estimation of thermal performance. There are two values
in common usage: the value determined on a single layer board and the value obtained on a board with two planes.
The value that more closely approximates a specific application depends on the power dissipated by other
components on the printed circuit board (PCB). The value obtained using a single layer board is appropriate for
tightly packed PCB configurations. The value obtained using a board with internal planes is more appropriate for
boards with low power dissipation (less than 0.02 W/cm
Based on an estimation of junction temperature using this technique, determine whether a more detailed thermal
analysis is required. Standard thermal management techniques can be used to maintain the device thermal junction
temperature below its maximum. If T
dissipation of the chip. You can verify the junction temperature by measuring the case temperature using a small
diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case
that is painted black. The MSC8144 device case surface is too shiny (low emissivity) to yield an accurate infrared
temperature measurement. Use the following equation to determine T
where
4
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
76
MSC8144
Part
T
R θ
P
P
P
T
θ
P
A
JA
D
INT
I/O
D
T
JA
= thermocouple (or infrared) temperature on top of the package (°C)
= ambient temperature near the package (°C)
= P
= power dissipation in the package (W)
= thermal characterization parameter (°C/W)
= power dissipated from device on output pins (W)
= I
= junction-to-ambient thermal resistance (°C/W)
Flip Chip Plastic Ball Grid Array (FC-PBGA)
Ordering Information
INT
DD
Thermal Considerations
+ P
× V
I/O
DD
= power dissipation in the package (W)
Package Type
= internal power dissipation (W)
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
J
appears to be too high, either lower the ambient temperature or the power
T
T
J
J
= T
= T
A
,
T
T
+ (R
+ (θ
J ,
Spheres
Lead-free
in °C can be obtained from the following:
θ
JA
JA
× P
2
× P
with natural convection) and well separated components.
D
D
)
)
Voltage
Core
1.0 V
J
:
Temperature
–40° to 105°C
Operating
0° to 90°C
Frequency
(MHz)
Core
1000
800
Freescale Semiconductor
Order Number
Equation 1
Equation 2
TBD
TBD