MCIMX27 Motorola Semiconductor Products, MCIMX27 Datasheet - Page 104

• Manufacturer Part Number: MCIMX27
• Manufacturer: Motorola Semiconductor Products

Package Information and Pinout
4.2
Table 58
these pins depend solely upon the user application, however there are a few factory test signals that are
not used in a normal application. Following is a list of these signals and how they are to be terminated for
proper operation of the i.MX27 processor:
Table 58
power supply voltages.
104
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CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in
of the signals at a particular pad are shown in the form of a compound signal name. Please refer to
Table 3
shows the device pin list, sorted by signal identification, including pad locations for ground and
identifies the pin assignments for the ball grid array (BGA) for full package. The connections of
Pin Assignments
for complete information on the signal multiplexing schemes of these signals.
Table 58. i.MX27 24 x 24 BGA (Signal ID by Ball Grid Location)
i.MX27 Data Sheet, Advance Information, Rev. 0.1
Preliminary—Subject to Change Without Notice
Table 58
Pin Name
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A0
A1
A2
are multiplexed with other signals. For ease of reference, all
Ball Grid
Location
AC12
W11
AB9
AC7
AC6
AB4
AC3
AB1
AA2
Y11
W2
U2
U1
U6
Y1
T6
P6
V8
Y6
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