MCIMX27 Motorola Semiconductor Products, MCIMX27 Datasheet - Page 43

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MCIMX27

Manufacturer Part Number
MCIMX27
Description
Manufacturer
Motorola Semiconductor Products
Datasheet

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Table 8
3.4.1
Table 9
states are specified. The temperature setting of 25
per the temperature range shown in
Table 10
Freescale Semiconductor
1
2
3
ID
11
12
13
Segments 11, 14, 15 are mixture of Fast and Slow GPIO.
Switching duty cycles must be limited to a cumulative duration of 1 year or less (20% duty cycle for a 5 yr. rated part) to sustain
a MAX N
time that the pad is powered to N
or cause permanent damage to the device. N
power supply feature.
Segments 1, 3, 4 are mixture of DDR and Fast GPIO.
ID
1
OSC32V
OSC26V
Operating Ambient Temperature
provides information for interface frequency limits.
defines the frequency settings used for specifying power consumption in
shows the power consumption for the i.MX27 device.
VDD
ID
1
2
3
4
5
Current Consumption
DD
DD
operating voltage of 3.3 V without significant device degradation. A switching cycle is defined as the period of
JTAG: TCK Frequency of Operation
Table 9. Frequency Definition for Power Consumption Measurement
Parameter
Parameter
VDD
Table 7. DC Operating Conditions (continued)
MCU AHB bus
i.MX27 Data Sheet, Advance Information, Rev. 0.1
MCU IP bus
Parameter
MCU core
MCU core
Preliminary—Subject to Change Without Notice
and actively switching. Switching cycles exceeding this limit may affect device reliability
OSC32
Table
Table 8. Interface Frequency
VDD
7.
13 should not be shorted to other N
°
C is used for specifying the Deep Sleep Mode (DSM)
Symbol
Symbol
V
V
f
JTAG
OSC32
OSC26
T
f
f
f
A
MCUmeas@266
MCUmeas@400
f
MCU-AHBmeas
osc32khzmeas
f
MCU-IPmeas
Symbol
Min
DC
VDD
2.68
Min
–20
1.1
x supplies, if want to use the separate
32.768
Value
266
400
133
Typ
66
5
Table
Typ
10. All power
Signal Descriptions
33.25
Max
Units
MHz
MHz
MHz
MHz
kHz
2.875
Max
1.6
85
Units
MHz
Units
o
V
V
C
43

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