MT55L128L18F1 Micron Semiconductor Products, Inc., MT55L128L18F1 Datasheet - Page 18

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MT55L128L18F1

Manufacturer Part Number
MT55L128L18F1
Description
2Mb ZBT SRAM, 3.3V Vdd, 3.3V I/O, Flow-Through,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet

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Part Number:
MT55L128L18F1-10A
Quantity:
22
NOT RECOMENDED FOR NEW DESIGNS
REVISION HISTORY
Added “NOT RECOMENDED FOR NEW DESIGNS,” REV. C, Pub. 11/02, FINAL ........................ November/20/02
Removed FBGA package, REV 6/01, FINAL ............................................................................................................. June/7/01
Removed FBGA Part Marking Guide, REV 8/00, FINAL ................................................................................. August/22/00
Changed FBGA capacitance values, REV 8/00, FINAL ...................................................................................... August/7/00
C
C
C
Removed IT References, REV 7/00, FINAL ............................................................................................................. July/10/00
Added FBGA Part Marking Guide
Removed IT from Part Number Example, REV 6/00, FINAL .............................................................................. June/21/00
Added # of datalines to the databus in the Block Diagrams
Added Note - “Preliminary Package Data” to FBGA Capacitance and Thermal Resistance Tables
Changed heading on Mechanical Drawing from BGA to FBGA
Added 165-Pin FBGA package, REV 5/00, FINAL ................................................................................................. May/23/00
Added PRELIMINARY PACKAGE DATA to diagram
2Mb: 128K x 18, 64K x 32/36 3.3V I/O, Flow-Through ZBT SRAM
MT55L128L18F1_C.p65 – Rev. C, Pub. 11/02
I
O
CK
; TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF
; TYP 4pF from 6pF; MAX. 5pF from 7pF
; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF
3.3V I/O, FLOW-THROUGH ZBT SRAM
18
2Mb: 128K x 18, 64K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.

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