pcf8535 NXP Semiconductors, pcf8535 Datasheet - Page 46
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
pcf8535
Manufacturer Part Number
pcf8535
Description
65 X 133 Pixel Matrix Driver
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8535.pdf
(56 pages)
- Current page: 46 of 56
- Download datasheet (277Kb)
Philips Semiconductors
2001 Nov 07
bump/align 4
65
SYMBOL
dummy
V
V
V
V
V
V
V
V
SCL
SCL
R32
R31
R30
R29
R28
R27
R26
R25
R24
R23
R22
R21
R20
R19
R18
R17
R16
T5
T4
SS1
SS1
SS1
SS1
SS1
SS1
SS1
SS1
133 pixel matrix driver
PAD
243
244
245
246
247
248
249
250
251
252
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
1050
x
3146
3216
3286
3356
3426
3496
3566
3636
3846
4056
4126
4406
4476
4605
4826
4896
4966
5036
5106
5176
5246
5316
5386
5456
5526
5596
5666
5736
5806
5876
5946
y
46
Table 23 Alignment marks
Table 24 Dimensions
Alignment mark 1
Alignment mark 2
Alignment mark 3
Alignment mark 4
Dummy bump/alignment
mark 1
Dummy bump/alignment
mark 2
Dummy bump/alignment
mark 3
Dummy bump/alignment
mark 4
Bottom left
Top right
Pad pitch
Pad size; Al
CBB opening
Bump dimensions
Wafer thickness
Alignment mark
Dummy/alignment mark
Wafer dimensions
MARKS
PAD
minimum 70 (see
Fig.32)
62
Fig.32)
36
50
381
12.660 x 2360 (see
Fig.32)
100 (see Fig.30)
80 (see Fig.31)
+1045
+1045
+1050
+1050
+1180
1045
1045
1050
1050
1180
100 (see
76 (see Fig.32)
90
25
x
SIZE
Product specification
17.5 ( 5)
PCF8535
+4620
+6196
+6081
+4414
+6330
4720
6196
6081
4605
6330
y
UNIT
m
m
m
m
m
m
m
m
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