pcf8535 NXP Semiconductors, pcf8535 Datasheet - Page 52

• Manufacturer Part Number: pcf8535
• Description: 65 X 133 Pixel Matrix Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
20 PURCHASE OF PHILIPS I
21 BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern
processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors
assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of
the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
2001 Nov 07
65
133 pixel matrix driver
Purchase of Philips I
components in the I
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C system provided the system conforms to the I
2
C components conveys a license under the Philips’ I
52
2
C specification defined by
2
C patent to use the
Product specification
PCF8535