uja1066 NXP Semiconductors, uja1066 Datasheet - Page 62

• Manufacturer Part Number: uja1066
• Description: High-speed Can Fail-safe System Basis Chip
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Package outline
Fig 24. Package outline SOT549-1 (HTSSOP32)
UJA1066_2
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
D h
Rev. 02 — 5 May 2009
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
High-speed CAN fail-safe system basis chip
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
L
0.1
p
w
UJA1066
© NXP B.V. 2009. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
62 of 69
o
A