uja1066 NXP Semiconductors, uja1066 Datasheet - Page 65
uja1066
Manufacturer Part Number
uja1066
Description
High-speed Can Fail-safe System Basis Chip
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1066.pdf
(69 pages)
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Part Number:
uja1066TW/5V0/T
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NXP Semiconductors
UJA1066_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Fig 25. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 02 — 5 May 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN fail-safe system basis chip
temperature
peak
UJA1066
© NXP B.V. 2009. All rights reserved.
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