ptn3700 NXP Semiconductors, ptn3700 Datasheet - Page 3

• Manufacturer Part Number: ptn3700
• Description: 1.8 V Simple Mobile Interface Link Bridge Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
4. Ordering information
Table 1.
[1]
5. Functional diagram
PTN3700_1
Product data sheet
Type number
PTN3700EV/G
0.5 mm ball pitch; 1.0 mm maximum package height.
Ordering information
4.1 Ordering options
Solder process
Pb-free (SnAgCu
solder ball compound)
Table 2.
Type number
PTN3700EV/G
Fig 1. Functional diagram of PTN3700 in Transmitter mode
PSEL[1:0]
LS[1:0]
G[7:0]
R[7:0]
B[7:0]
A[1:0]
PCLK
XSD
FSS
HS
DE
VS
Ordering options
TX/RX = HIGH
Package
Name
VFBGA56 plastic very thin fine-pitch ball grid array package;
8
8
8
2
2
2
PTN3700
Topside mark
3700
REGISTER
Rev. 01 — 14 August 2007
INPUT
PLL
Description
56 balls; body 4
N
1
PCLK
SYNC WORD ENCODING
PCLK
Temperature range
POWER MANAGEMENT
PROTOCOL MAPPING,
40 C to +85 C
PARITY ENCODING,
CONFIGURATION
4.5
1.8 V simple mobile interface link bridge IC
AND
0.65 mm
GND
2
[1]
VDD
SERIALIZER
GNDA
FSS
1
0
VDDA
PTN3700
002aab363
© NXP B.V. 2007. All rights reserved.
Version
SOT991-1
D0+
D0
D1+
D1
D2+
D2
CLK+
CLK
3 of 41