ptn3700 NXP Semiconductors, ptn3700 Datasheet - Page 38

• Manufacturer Part Number: ptn3700
• Description: 1.8 V Simple Mobile Interface Link Bridge Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
16. Abbreviations
PTN3700_1
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 26.
Acronym
CIF
CMOS
DDR
EMI
fps
HVGA
I/O
LVDS
MSB
PCB
PLL
QVGA
RGB
SMILi
SubLVDS
SVGA
UI
VGA
WQVGA
Fig 35. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Common Intermediate Format
Complementary Metal Oxide Semiconductor
Double Data Rate
ElectroMagnetic Interference
frames per second
Half-size Video Graphics Array
Input/Output
Low-Voltage Differential Signalling
Most Significant Bit
Printed-Circuit Board
Phase-Locked Loop
Quarter Video Graphics Array
Red/Green/Blue
Simple Mobile Interface Link
Sub Low-Voltage Differential Signalling
Super Video Graphics Array
Unit Interval
Video Graphics Array
Wide Quarter Video Graphics Array
Rev. 01 — 14 August 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
1.8 V simple mobile interface link bridge IC
temperature
peak
PTN3700
© NXP B.V. 2007. All rights reserved.
001aac844
time
38 of 41