ptn3700 NXP Semiconductors, ptn3700 Datasheet - Page 32

• Manufacturer Part Number: ptn3700
• Description: 1.8 V Simple Mobile Interface Link Bridge Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PTN3700_1
Product data sheet
12.3 Power decoupling configuration
12.4 PCB/Flex layout guideline
The PTN3700 needs 1.8 V V
regulator, and use a 10
the decoupling is shown in
capacitor for each VDD pin and one 0.01 F ceramic capacitor for VDDA pin, and the lead
length between the IC power pins and decoupling capacitors should be as short as
possible.
The high data rate at the serial I/O requires some specific implementations in the PCB
and flex layout design. The following practices can be used as guideline:
Fig 25. Power decoupling configuration
•
•
•
•
The differential pair must be routed symmetrically. Keep all four pairs of differential
signal traces the same length. The difference in trace length should be less than
20 mils.
Maintain 100
Do not route signals over any plane split; use only one ground plane underneath the
differential signals.
Avoid any discontinuity for signal integrity. Differential pairs should be routed on the
same layer and the number of vias on the differential traces should be minimized. Test
points should be placed in series and symmetrically. Stubs should not be introduced
on the differential pairs.
VDD
differential impedance.
Rev. 01 — 14 August 2007
resistor for isolation. The recommended power configuration of
Figure
DD
0.1 F
and 1.8 V V
25. It is recommended to install one 0.1 F ceramic
0.1 F
1.8 V simple mobile interface link bridge IC
DDA
0.1 F
. Both can share the same voltage
10
0.01 F
002aac937
VDDA
PTN3700
© NXP B.V. 2007. All rights reserved.
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