lpc2917 NXP Semiconductors, lpc2917 Datasheet - Page 60

• Manufacturer Part Number: lpc2917
• Description: Arm9 Microcontroller With Can And Lin
• Manufacturer: NXP Semiconductors

NXP Semiconductors
LPC2917_19_1
Preliminary data sheet
14.3.2 Wave soldering
Table 32.
Table 33.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Package thickness (mm)
< 2.5
t 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 16. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
Figure
Rev. 1.01 — 15 November 2007
16.
= minimum soldering temperature
Package reflow temperature (qC)
Volume (mm
< 350
235
220
Package reflow temperature (qC)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
ARM9 microcontroller with CAN and LIN
350 to 2000
260
250
245
t 350
220
220
temperature
LPC2917/19
peak
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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