lf3312 LOGIC Devices Incorporated, lf3312 Datasheet - Page 31

• Manufacturer Part Number: lf3312
• Description: 12-mbit Frame Buffer / Fifo
• Manufacturer: LOGIC Devices Incorporated

DEVICES INCORPORATED
LOGIC Devices Incorporated
c. Input voltages on a test fixture should be adjusted to compensate for inductive ground and VCC
noise to maintain required input levels relative to the device ground pin.
10. Each parameter is shown as a minimum or maximum value. Input requirements are specified
from the point of view of the external system driving the chip. Setup time, for example, is specified
as a minimum since the external system must supply at least that much time to meet the worst-
case requirements of all parts. Responses from the internal circuitry are specified from the point of
view of the device. Output delay, for example, is specified as a maximum since worst-case opera-
tion of any device always provides data within that time.
11. For the t ena test, the transition is measured to the 1.5 V crossing point with datasheet loads.
For the t dis test, the transition is measured to the ±200mV level from the measured steady-state
output voltage with ±10mA loads. The balancing voltage, V th , is set at 3.0 V for Z-to-0 and 0-to-Z
tests, and set at 0 V for Z-to-1 and 1-to-Z tests.
12. These parameters are only tested at the high temperature extreme, which is the worst case
Notes
F
IGURE
DUT
A. O
C
UTPUT
L
S1
L
OADING
I
OH
C
IRCUIT
V
TH
31
I
OL
F
Z
Z
IGURE
OE
0
1
V
V
OH
OL
*
*
B. T
Measured V
Measured V
12-Mbit Frame Buffer / FIFO
1.5 V
t
ENA
HRESHOLD
1.5 V
1.5 V
OL
OH
Preliminary Datasheet
with I
with I
Video Imaging Product
OH
OH
V
V
L
OL
OH
= –10mA and I
= –10mA and I
1.5 V
EVELS
*
*
0.2 V
0.2 V
t
DIS
August 8, 2006 LDS.3312 O
OL
OL
= 10mA
= 10mA
LF3312
3.0V Vth
0
1
0V Vth
Z
Z