lrs1302 Sharp Microelectronics of the Americas, lrs1302 Datasheet - Page 55

• Manufacturer Part Number: lrs1302
• Description: 8m Flash And 1m Sram
• Manufacturer: Sharp Microelectronics of the Americas

5. Packing
4-9.
4 - 8. Indications
4 - 7. Packing
This dry packing
surface
may suddenly
soldering
between the resin
the storage
Dry packing
packages on the PCB (Printed
When the epoxy resin
humidity,
mount type package for a relatively
between the epoxy resin
Protection
Embossed carrier
deterioration
*The following
. The leading
. The number of IC packages enclosed
. The top covering
shall,
attached
carrier
be held in place with paper adhesive
empty (with embossed portions
Specification
2)Storage
3)Production
4)Manufacture’s
__________-----____----------
l)Part
____________________________
______________________________________.-______________---_----------------------
______________________________________.___________________--------------------------------------
______________________________________._______________---_--------------------------------------
___________----____----------
mount packages.
SOP44-P-600
TSOP$O-P-0813.
SOP24-P-450
SOP28-P-450
SOP32-P-525
Package Type
SOP14-P-225
SOP16-P-225
in principle.
process
tape,
it may absorb 0.15%
Numger (Product
drawing
While
and opening
is used for the purpose of maintaining
vaporize
Quantity
and trailing
in electrical
shall
and the trailing
Date
(Dry packing
is designed
tape should be free from deformed IC leads and
in Transit
and insert
(e.g.
tape (leader
(NO. CV522).
Name (SHARP)
__________.___________________--------------------------------------
_________.______________________________---------------------------
_________.___________________--------------------------------------
which is used for plastic
be indicated
into steam when the entire
be as listed
of dry packing.
VPS). This causes expansion
Please conform to the following
and insert
Name)
edges of the embossed carrier
characteristics.
material,
to prevent
Circuit
for surface
Number of IC Packages/Reel
or more of its weight
LRS13023
side)
not filled
edge of the embossed carrier
on the taping
material
below.
large chip absorbs a large amount of moisture
in the embossed carrier
Board).
2,500 pcs
1,000 pcs
1,000 pcs
1,000 pcs
2,500 pcs
1.500 pcs
at the leading
and sometimes cracking
tape exceeding
750
the above problem from occurring
mount packages)
with IC packages),
pcs
(e.g.
packages is stored
reel and the packing
package is heated during
---___-_--____--
chip, lead frame)
IC quality
and results
edge of the embossed
in moisture.
3Omm in length.
conditions
tape shall
tape per reel
of the package.
tape,
in the
after
in separation
at high
If
concerning
this
be left
mounting
shall
the surface
case.
moisture
in
the
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