lrs1302 Sharp Microelectronics of the Americas, lrs1302 Datasheet - Page 56

• Manufacturer Part Number: lrs1302
• Description: 8m Flash And 1m Sram
• Manufacturer: Sharp Microelectronics of the Americas

SHARP
5 - 4. Baking
5-3.
5-
5-2.
1. Store under conditions
(3)
( 2)
( 1)
Storage after
Perform the following
(3)
Notes on opening
(2)
( 1)
(1)
(2)
ICs in dry
Before opening
grounded against
packing
Storage
After
5-3.(l).
Recommended baking
mounting.
hours at 150°C. Note that the embossed carrier
at the above temperature.
Baking
If the above conditions
(A)
(B)
Total
First
To re-store
3 days, and store
mount ICs within
opening
packing
environment
80% or less,
After
temperature
Temperature
Humidity
(drying)
baking
If
If
opening+
period
opening
is necessary
after
!
i 60%RH
with desiccant
the dry packing,
opening
the humidity
the procedure
The recommended conditions
before mounting
the dry packing
the dry packing,
with a temperature
of 5--25°C and a relative
the ICs for an extended period
ICs, store
range
of storage
ESD and use a grounding
baking
5--25x
and mount ICs within
the dry packing,
the dry packing
to prevent
X1 +re-sealing+
3 days after
shown below before
the ICs in the same environment
conditions
or less
:
:
indicator
5-40x
80% RH or less
in section
(whoes indicater
the ICs in the same environment
LRS13023
(A) and (B) are applicab
after
use a dry box or re-seal
Please transfar
-
absorption
i 8O%RH
i
prepare
opening dry packing.
first
of 5-40°C
store
in the desiccant
5-3
5 -40°C
2 weeks.
opening and re-opening
a working table
are 16-24
opening the dry packing
strap.
the ICs in an environment
Y
humidity
of moisture
could not
or less
is blue),
ICs to heat resistant
+re-opening-
and a relative
of time within
tape can not be
of 60% or less and
hours at 120°C
j 60%RH
le, bake it be
becomes pink
be per formed
as sect ion 5-3. (1).
the ICs in the dry
and store
after
which is
5~25°C
as section
opening,
humidity
Xz -mount ing
3 days after
or less
is within
in an
fore
or 5-10
baked
with a
carrier.
of
(
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