ST72F63 STMICROELECTRONICS [STMicroelectronics], ST72F63 Datasheet - Page 108

• Manufacturer Part Number: ST72F63
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ST7263B
EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to V
local protection between the pad and V
5b) is implemented to completely absorb the posi-
tive ESD discharge.
Figure 58. Positive Stress on a True Open Drain Pad vs. V
Figure 59. Negative Stress on a True Open Drain Pad vs. V
Figure 60. Multisupply Configuration
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Main path
Path to avoid
Main path
V
V
DD
DD
SS
are not implemented. An additional
V
V
V
V
SS
SS
DD
DD
V
V
DDA
SSA
(5a)
(3b)
(3b)
(3b)
SS
(5a &
OUT
OUT
BACK TO BACK DIODE
BETWEEN GROUNDS
Multisupply Configuration
When several types of ground (V
power supply (V
reason (better noise immunity...), the structure
shown in
device against ESD.
(4)
(4)
SS
DD
Figure 60
IN
IN
DD
(2b)
, V
is implemented to protect the
DDA
(2b)
(1)
(1)
, ...) are available for any
SS
(3b)
V
V
(5b)
, V
DDA
SSA
SSA
, ...) and
V
V
V
V
SS
SS
DD
DD