AD9775EB AD [Analog Devices], AD9775EB Datasheet - Page 5

• Manufacturer Part Number: AD9775EB
• Description: 14-Bit, 160 MSPS 2X/4X/8X Interpolating Dual TxDAC+ D/A Converter
• Manufacturer: AD [Analog Devices]

DIGITAL SPECIFICATIONS
Parameter
DIGITAL INPUTS
CLOCK INPUTS
ABSOLUTE MAXIMUM RATINGS*
Parameter
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, REFLO, FSADJ1/2
I
P1B13–P1B0, P2B13–P2B0
DATACLK, PLL_LOCK
CLK+, CLK–, RESET
LPF
SPI_CSB, SPI_CLK,
SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
*Stresses above those listed under the ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only; functional
Model
AD9775BSV –40°C to +85°C
AD9775EB
*SV = Thin Plastic Quad Flatpack
REV. 0
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD9775 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Specifications subject to change without notice.
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum ratings for extended periods may affect device reliability.
OUTA
Logic “1” Voltage
Logic “0” Voltage
Logic “1” Current
Logic “0” Current
Input Capacitance
Input Voltage Range
Common-Mode Voltage
Differential Voltage
, I
OUTB
Temperature
Range
ORDERING GUIDE
Package
Description
80-Lead TQFP
Evaluation Board
With Respect to
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
(T
otherwise noted.)
MIN
to T
MAX
, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 0 V, DVDD = 3.3 V, I
Package
Option*
SV-80
–5–
THERMAL CHARACTERISTICS
Thermal Resistance
80-Lead Thermally Enhanced
TQFP Package
*With thermal pad soldered to PCB.
Min
–0.3
–4.0
–0.3
–0.3
–1.0
–0.3
–0.3
–0.3
–0.3
–0.3
–65
Min
2.1
–10
–10
0
0.75
0.5
JA
= 23.5 °C/W*
Typ
3
0
5
1.5
1.5
Max
+4.0
+4.0
+0.3
AVDD + 0.3
AVDD + 0.3
DVDD + 0.3
DVDD + 0.3
CLKVDD + 0.3
CLKVDD + 0.3
DVDD + 0.3
+125
+150
+300
Max
0.9
+10
+10
3
2.25
WARNING!
OUTFS
ESD SENSITIVE DEVICE
= 20 mA, unless
Unit
V
V
µA
µA
pF
V
V
V
AD9775
Unit
V
V
V
V
V
V
V
V
V
V
°C
°C
°C