MPC106ARX66CE MOTOROLA [Motorola, Inc], MPC106ARX66CE Datasheet - Page 20
MPC106ARX66CE
Manufacturer Part Number
MPC106ARX66CE
Description
PCI Bridge/Memory Controller
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
1.MPC106ARX66CE.pdf
(28 pages)
- Current page: 20 of 28
- Download datasheet (143Kb)
1.7 Package Description
The following sections provide the package parameters and the mechanical dimensions for the 106.
1.7.1 Package Parameters
The package parameters are as provided in the following list. The package type is a 21 mm x 25 mm,
304-lead C4 ceramic ball grid array (CBGA).
20
Package outline
Interconnects
Pitch
Solder attach
Solder balls
Maximum module height
Co-planarity specification
MPC106 PCI Bridge/Memory Controller Hardware Specifications
21 mm x 25 mm
303 (16 x 19 ball array minus one)
1.27 mm
63/37 Sn/Pb
10/90 Sn/Pb, 0.89 mm diameter
3.16 mm
0.15 mm
Related parts for MPC106ARX66CE
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
MPC10 1K0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC10 200R 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC10 2K0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC10 20K 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC10 500R 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
Silicon Controlled Rectifiers
Manufacturer:
MOTOROLA [Motorola, Inc]
Datasheet:
Part Number:
Description:
RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs
Manufacturer:
MOTOROLA [Motorola, Inc]
Datasheet:
Part Number:
Description:
RF POWER FIELD EFFECT TRANSISTORS
Manufacturer:
MOTOROLA [Motorola, Inc]
Datasheet:
Part Number:
Description:
LATERAL N-CHANNEL BROADBAND RF POWER MOSFETs
Manufacturer:
MOTOROLA [Motorola, Inc]
Datasheet:
Part Number:
Description:
RF POWER FIELD EFFECT TRANSISTOR
Manufacturer:
MOTOROLA [Motorola, Inc]
Datasheet: