MPC106ARX66CE MOTOROLA [Motorola, Inc], MPC106ARX66CE Datasheet - Page 25

• Manufacturer Part Number: MPC106ARX66CE
• Description: PCI Bridge/Memory Controller
• Manufacturer: MOTOROLA [Motorola, Inc]

1.8.5.1 Internal Package Conduction Resistance
For this C4/CBGA packaging technology, the intrinsic conduction thermal resistance paths are as follows:
These parameters are shown in Table 13. In this C4/CBGA package, the silicon chip is exposed; therefore,
the package “case” is the top of the silicon.
Figure 15 provides a simplified thermal network in which a C4/CBGA package is mounted to a
printed-circuit board.
•
•
Chip with C4 Encapsulant
Ceramic Substrate
Printed-Circuit Board
The die junction-to-case thermal resistance
The die junction-to-lead thermal resistance
Junction-to-case thermal resistance
Junction-to-lead (ball) thermal resistance
External Resistance
External Resistance
Internal Resistance
Figure 15. C4/CBGA Package Mounted to a Printed-Circuit Board
MPC106 PCI Bridge/Memory Controller Hardware Specifications
Thermal Metric
Figure 14. Exploded Cross-Sectional View
Printed-Circuit Board
(Note the internal versus external package resistance)
Table 13. Thermal Resistance
Heat Sink
Radiation
Radiation
0.133 °C/W
3.8 °C/W
Convection
Convection
Effective Thermal Resistance
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
System Design Information
CBGA Joint
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