SE97BTP NXP [NXP Semiconductors], SE97BTP Datasheet - Page 3
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SE97BTP
Manufacturer Part Number
SE97BTP
Description
DDR memory module temp sensor with integrated SPD
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.SE97BTP.pdf
(53 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
10 000
Company:
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
7 250
Company:
Part Number:
SE97BTP/L547
Manufacturer:
NEC
Quantity:
6 586
NXP Semiconductors
3. Applications
4. Ordering information
Table 2.
[1]
SE97B_1
Product data sheet
Type number
SE97BTP
Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC WCE-3, PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
[1]
Ordering information
Topside
mark
97B
2.3 Serial EEPROM features
Programmable hysteresis threshold: off, 0 °C, 1.5 °C, 3 °C, 6 °C
Over/under/critical temperature EVENT output
B-grade accuracy:
Read and write voltage range: 3.0 V to 3.6 V
Operating current:
Organized as 1 block of 256 bytes (256 × 8)
100,000 write/erase cycles and 10 years of data retention
Permanent and Reversible Software Write Protect
Software Write Protection for the lower 128 bytes
DDR2 and DDR3 memory modules
Laptops, personal computers and servers
Enterprise networking
Hard disk drives and other PC peripherals
Package
Name
HWSON8
±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C
±1.0 °C/±2 °C (typ./max.) → +40 °C to +125 °C
±2.0 °C/±3 °C (typ./max.) → −40 °C to +125 °C
Write → 0.6 mA (typ.) for 3.5 ms (typ.)
Read → 100 μA (typ.)
Description
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
Rev. 01 — 27 January 2010
DDR memory module temp sensor with integrated SPD
© NXP B.V. 2010. All rights reserved.
SE97B
Version
SOT1069-2
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