SE97BTP NXP [NXP Semiconductors], SE97BTP Datasheet - Page 46
![no-image](/images/no-image-200.jpg)
SE97BTP
Manufacturer Part Number
SE97BTP
Description
DDR memory module temp sensor with integrated SPD
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.SE97BTP.pdf
(53 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
10 000
Company:
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
7 250
Company:
Part Number:
SE97BTP/L547
Manufacturer:
NEC
Quantity:
6 586
NXP Semiconductors
12. Package outline
Fig 41. Package outline SOT1069-2 (HWSON8)
SE97B_1
Product data sheet
HWSON8: plastic thermal enhanced very very thin small outline package; no leads;
8 terminals; body 2 x 3 x 0.8 mm
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
SOT1069-2
Unit
Outline
version
max
nom
min
0.80
0.75
0.70
A
(1)
0.05
0.02
0.00
A
terminal 1
index area
terminal 1
index area
1
0.65
0.55
0.45
A
X
E
IEC
L
- - -
2
2
0.2
A
3
1
8
0.30
0.25
0.18
e
b
D
e
D
1
D
2
2.1
2.0
1.9
MO-229
JEDEC
(1)
b
1.6
1.5
1.4
D
4
5
2
References
Rev. 01 — 27 January 2010
E
3.1
3.0
2.9
(1)
B
K
0
w
v
1.6
1.5
1.4
E
A
E
2
JEITA
DDR memory module temp sensor with integrated SPD
- - -
C
C
scale
0.5
e
A
1
B
1.5
e
1
A
0.40
0.35
0.30
A
2 mm
K
2
A
0.45
0.40
0.35
1
L
y
1
C
0.1
v
detail X
0.05
w
European
projection
0.05
y
C
0.05
y
1
y
© NXP B.V. 2010. All rights reserved.
A
3
Issue date
SE97B
09-10-22
09-11-18
sot1069-2_po
SOT1069-2
46 of 53