SE97BTP NXP [NXP Semiconductors], SE97BTP Datasheet - Page 52
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SE97BTP
Manufacturer Part Number
SE97BTP
Description
DDR memory module temp sensor with integrated SPD
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.SE97BTP.pdf
(53 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
10 000
Company:
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
7 250
Company:
Part Number:
SE97BTP/L547
Manufacturer:
NEC
Quantity:
6 586
NXP Semiconductors
18. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
7.3.2.2
7.3.3
7.3.3.1
7.3.3.2
7.3.3.3
7.4
7.4.1
7.5
7.6
7.7
7.8
7.9
7.10
7.10.1
7.10.1.1
7.10.1.2
7.10.1.3
7.10.2
7.10.2.1
7.10.2.2
7.10.2.3
SE97B_1
Product data sheet
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
EVENT output condition . . . . . . . . . . . . . . . . . . 7
EVENT pin output voltage levels
and resistor sizing. . . . . . . . . . . . . . . . . . . . . . . 7
EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 9
EVENT operation modes . . . . . . . . . . . . . . . . 10
Switching between Comparator mode
and Interrupt mode . . . . . . . . . . . . . . . . . . . . . 10
What temperature is read when conversion
is in progress . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus Alert Response Address
(ARA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clear Reversible Write Protection (CRWP) . . 19
Read Reversible Write Protection (RRWP),
and Read Clear Reversible Write Protection
(RCRWP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Temperature sensor features . . . . . . . . . . . . . . 2
Serial EEPROM features . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Comparator mode. . . . . . . . . . . . . . . . . . . . . . 10
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . 10
Conversion rate . . . . . . . . . . . . . . . . . . . . . . . 11
Power-up default condition . . . . . . . . . . . . . . . 11
Device initialization . . . . . . . . . . . . . . . . . . . . . 11
SMBus TIMEOUT . . . . . . . . . . . . . . . . . . . . . . 12
SMBus/I
EEPROM operation . . . . . . . . . . . . . . . . . . . . 15
Write operations . . . . . . . . . . . . . . . . . . . . . . . 16
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Acknowledge polling . . . . . . . . . . . . . . . . . . . . 17
Memory Protection . . . . . . . . . . . . . . . . . . . . . 17
Permanent Write Protection (PWP) . . . . . . . . 18
Reversible Write Protection (RWP) and
Read Permanent Write Protection (RPWP),
2
C-bus interface . . . . . . . . . . . . . . . . 13
Rev. 01 — 27 January 2010
DDR memory module temp sensor with integrated SPD
7.10.3
7.10.3.1
7.10.3.2
7.10.3.3
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
9
9.1
9.2
9.3
9.4
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
Register descriptions . . . . . . . . . . . . . . . . . . . 22
Application design-in information. . . . . . . . . 35
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 38
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 46
Soldering of SMD packages . . . . . . . . . . . . . . 47
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision history . . . . . . . . . . . . . . . . . . . . . . . 50
Legal information . . . . . . . . . . . . . . . . . . . . . . 51
Read operations. . . . . . . . . . . . . . . . . . . . . . . 20
Current address read . . . . . . . . . . . . . . . . . . . 20
Selective read . . . . . . . . . . . . . . . . . . . . . . . . 20
Sequential read . . . . . . . . . . . . . . . . . . . . . . . 21
Register overview . . . . . . . . . . . . . . . . . . . . . 22
CAP — Capability register
(00h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 23
CONFIG — Configuration register
(01h, 16-bit read/write). . . . . . . . . . . . . . . . . . 24
Temperature format . . . . . . . . . . . . . . . . . . . . 28
Temperature Trip Point registers . . . . . . . . . . 29
UPPER — Upper Boundary Alarm Trip
register (02h, 16-bit read/write) . . . . . . . . . . . 29
LOWER — Lower Boundary Alarm Trip
register (03h, 16-bit read/write) . . . . . . . . . . . 30
CRITICAL — Critical Alarm Trip register
(04h, 16-bit read/write). . . . . . . . . . . . . . . . . . 30
TEMP — Temperature register
(05h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 31
MANID — Manufacturer’s ID register
(06h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 32
DEVICEID — Device ID register
(07h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 32
SMBUS — SMBus register
(22h, 8-bit read/write). . . . . . . . . . . . . . . . . . . 33
SE97B in memory module application . . . . . . 36
Layout consideration . . . . . . . . . . . . . . . . . . . 36
Thermal considerations . . . . . . . . . . . . . . . . . 36
Hot plugging. . . . . . . . . . . . . . . . . . . . . . . . . . 37
Introduction to soldering. . . . . . . . . . . . . . . . . 47
Wave and reflow soldering. . . . . . . . . . . . . . . 47
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 47
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 48
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 51
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 51
© NXP B.V. 2010. All rights reserved.
SE97B
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