SE97BTP NXP [NXP Semiconductors], SE97BTP Datasheet - Page 38
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SE97BTP
Manufacturer Part Number
SE97BTP
Description
DDR memory module temp sensor with integrated SPD
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.SE97BTP.pdf
(53 pages)
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10. Limiting values
11. Characteristics
Table 30.
V
SE97B_1
Product data sheet
Symbol
T
T
T
E
DD
lim(acc)
res
conv
f(conv)
= 3.0 V to 3.6 V; T
Parameter
temperature limit
accuracy
temperature resolution
conversion period
conversion rate error
Thermal sensor characteristics
amb
Table 29.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
V
T
V
I
T
sink
=
j(max)
stg
DD
n
A0
−
40
°
C to +125
Parameter
supply voltage
voltage on any other pin
voltage on pin A0
sink current
maximum junction temperature
storage temperature
Limiting values
Conditions
B-grade; V
percentage error in programmed data
T
T
T
amb
amb
amb
°
C; unless otherwise specified.
= 75 °C to 95 °C
= 40 °C to 125 °C
= −40 °C to +125 °C
Rev. 01 — 27 January 2010
DD
= 3.0 V to 3.6 V
DDR memory module temp sensor with integrated SPD
Conditions
SDA, SCL, A1, A2,
EVENT pins
overvoltage input; A0 pin
SDA, EVENT pins
Min
−1.0
−2.0
−3.0
-
-
−30
Typ
< ±0.5
< ±1.0
< ±2
0.125
100
-
Min
−0.5
−0.5
−0.5
−1
-
−65
© NXP B.V. 2010. All rights reserved.
Max
+1.0
+2.0
+3.0
-
120
30
SE97B
150
Max
+4.3
+4.3
+12.5
+10
+165
Unit
°C
°C
°C
°C
ms
%
38 of 53
Unit
V
V
V
mA
°C
°C