XC68HC705JB3 Motorola, XC68HC705JB3 Datasheet - Page 125

• Manufacturer Part Number: XC68HC705JB3
• Description: MICROCONTROLLER
• Manufacturer: Motorola

14.1
14.2
MC68HC05JB3
REV 1
SEATING
PLANE
–T–
This section provides the mechanical dimensions for the 20-pin SDIP, and
28-pin SDIP, 20-pin SOIC, and 28-pin SOIC packages.
20-PIN PDIP (CASE 738)
28-PIN PDIP (CASE 710)
20
H
1
28
1
G
G
E
F
–A–
A
Figure 14-1. 20-Pin PDIP Mechanical Dimensions
Figure 14-2. 28-Pin PDIP Mechanical Dimensions
F
MECHANICAL SPECIFICATIONS
D
D
20 PL
15
14
10
11
0.25 (0.010)
MECHANICAL SPECIFICATIONS
N
SEATING
PLANE
N
B
B
K
K
C
M
November 5, 1998
SECTION 14
C
T
A
M
M
L
J
L
20 PL
J
0.25 (0.010)
GENERAL RELEASE SPECIFICATION
M
M
T
B
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
2. DIMENSION L TO CENTER OF LEADS
3. DIMENSION B DOES NOT INCLUDE
M
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
36.45
13.72
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
MIN
DIM
3.94
0.36
1.02
1.65
0.20
2.92
0.51
A
B
C
D
E
G
K
M
N
15.24 BSC
F
J
L
0
2.54 BSC
1.010
0.240
0.150
0.015
0.050
0.008
0.110
0.020
MIN
37.21
14.22
MAX
0.050 BSC
0.100 BSC
0.300 BSC
5.08
0.56
1.52
2.16
0.38
3.43
15
1.02
0
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.020
0.115
15
MIN
0.100 BSC
0.600 BSC
0
_
INCHES
MOTOROLA
25.66
MILLIMETERS
MIN
2.80
0.51
MAX
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
6.10
3.81
0.39
1.27
0.21
15
1.27 BSC
2.54 BSC
7.62 BSC
0
_
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
14-1
_