HI-6120 HOLTIC [Holt Integrated Circuits], HI-6120 Datasheet - Page 156

• Manufacturer Part Number: HI-6120
• Description: MIL-STD-1553 Remote Terminal ICs
• Manufacturer: HOLTIC [Holt Integrated Circuits]

23. PACKAGE DIMENSIONS
52-PIN PLASTIC QUAD FLAT PACK (PQFP)
64-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
(9.00)
.354
(1.00)
.039
BSC
max
(1.6)
.063
(13.2)
.520
MAX.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC SQ
(9.00)
Top View
.354
BSC
See Detail A
(1.6)
.063
HOLT INTEGRATED CIRCUITS
typ
Heat sink must be left floating or connected to V
HI-6120, HI-6121
Heat sink pad on bottom of package.
(0.20)
.008
DO NOT connect to GND.
typ
(10.0)
.394
156
BSC SQ
.055 .002
(7.15
.281 ± .006
(1.4 .05)
±
±
± .15
(0.40
.016 ± .004
)
± .10
)
DD
.
(.13)
.005
(7.15
.281 ± .006
Bottom
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
View
D
R min
(.20)
± .15
.008
ETAIL
.035 .006
(.88 ± .15)
.0256
(.65)
inches (millimeters)
Package Type: 64PCS
(.375 ± .075)
)
inches (millimeters)
min
Package Type: 52PTQS
.015 .003
±
A
(.13)
BSC
.005
±
R min
(0.50)
(0.25)
.0197
.010
0°
typ
BSC
7°