EX256-FCS100 ETC1 [List of Unclassifed Manufacturers], EX256-FCS100 Datasheet - Page 12

• Manufacturer Part Number: EX256-FCS100
• Description: eX Family FPGAs
• Manufacturer: ETC1 [List of Unclassifed Manufacturers]

Ju n ct i o n Te m p er a t u r e ( T
The temperature variable in the Designer Series software
refers to the junction temperature, not the ambient
temperature. This is an important distinction because the
heat generated from dynamic power consumption is usually
hotter than the ambient temperature. Equation 1, shown
below, can be used to calculate junction temperature.
Where:
T
∆ T = Temperature gradient between junction (silicon) and
ambient
∆ T =
P = Power
12
Package Type
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Chip Scale Package (CSP)
Chip Scale Package (CSP)
Chip Scale Package (CSP)
a
= Ambient Temperature
θ
ja
* P
Maximum Power Allowed
Junction Temperature = ∆ T + T
=
Max. junction temp. (°C) Max. ambient temp. (°C)
---------------------------------------------------------------------------------------------------------------------------------
J
)
a
Pin Count
(1)
θ
ja
100
128
180
64
49
(°C/W)
v3.0
–
θ
located in the
below.
P ac k ag e T h er m al C h ar a c t er i st i c s
The device junction to case thermal characteristic is θ
and the junction to ambient air characteristic is θ
thermal characteristics for θ
air flow rates.
The maximum junction temperature is 150 ° C.
A sample calculation of the absolute maximum power
dissipation allowed for a TQFP 100-pin package at
commercial temperature and still air is as follows:
ja
= Junction to ambient of package.
θ
14
12
3
3
3
jc
Package Thermal Characteristics
Still Air
=
51.2
37.5
71.3
54.1
57.8
θ
ja
150°C 70°C
---------------------------------- -
37.5°C/W
ja
are shown with two different
–
300 ft/min
56.0
47.8
θ
35
30
51
e X F a m il y F P GA s
ja
=
2.1W
θ
ja
numbers are
Units
°C/W
°C/W
°C/W
°C/W
°C/W
section
ja
. The
jc
,