IS42S16100E-6BLI-TR ISSI, IS42S16100E-6BLI-TR Datasheet - Page 31

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IS42S16100E-6BLI-TR

Manufacturer Part Number
IS42S16100E-6BLI-TR
Description
DRAM 16M 1Mx16 166Mhz SDRAM, 3.3v
Manufacturer
ISSI
Datasheet

Specifications of IS42S16100E-6BLI-TR

Rohs
yes
Data Bus Width
16 bit
Organization
1 Mbit x 16
Package / Case
BGA-60
Memory Size
16 Mbit
Maximum Clock Frequency
166 MHz
Access Time
6 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
3 V
Maximum Operating Current
180 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Factory Pack Quantity
1000
IS42S16100E, IS45S16100E
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
05/18/2010
Interval Between Write and Read Commands
A new read command can be executed while a write cycle
is in progress, i.e., before that cycle completes. Data
corresponding to the new read command is output after
the CAS latency has elapsed from the point the new read
command was executed. The I/On pins must be placed in
the HIGH impedance state at least one cycle before data
is output during this operation.
CAS latency = 3, burstlength = 4
CAS latency = 2, burstlength = 4
COMMAND
COMMAND
CLK
CLK
DQ
DQ
WRITE (CA=A, BANK 0)
WRITE (CA=A, BANK 0)
D
D
WRITE A0 READ B0
WRITE A0 READ B0
IN
IN
A0
A0
t
t
CCD
CCD
READ (CA=B, BANK 0)
READ (CA=B, BANK 0)
HI-Z
D
OUT
HI-Z
B0
The interval (t
one clock cycle.
The selected bank must be set to the active state before
executing this command.
D
D
OUT
OUT
B1
B0
D
D
OUT
OUT
ccD
B2
B1
) between command must be at least
D
D
OUT
OUT
B2
B3
D
OUT
B3
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