IS42S16100E-6BLI-TR ISSI, IS42S16100E-6BLI-TR Datasheet - Page 4

• Manufacturer Part Number: IS42S16100E-6BLI-TR
• Description: DRAM 16M 1Mx16 166Mhz SDRAM, 3.3v
• Manufacturer: ISSI

Specifications of IS42S16100E-6BLI-TR

• Rohs: yes
• Data Bus Width: 16 bit
• Organization: 1 Mbit x 16
• Package / Case: BGA-60
• Memory Size: 16 Mbit
• Maximum Clock Frequency: 166 MHz
• Access Time: 6 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V
• Maximum Operating Current: 180 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 1000

4
IS42S16100E, IS45S16100E
PIN FUNCTIONS
12, 39, 40, 42, 43,
2, 3, 5, 6, 8, 9, 11
TSOP Pin No. Symbol
45, 46, 48, 49
7, 13, 38, 44
4, 10, 41, 47
20 to 24
27 to 32
14, 36
26, 50
1, 25
19
16
34
35
18
17
15
A0-A10
DQ0 to
LDQM,
UDQM
VDDQ
GNDQ
DQ15
GND
VDD
CAS
CKE
CLK
RAS
A11
CS
WE
Power Supply Pin
Power Supply Pin
Power Supply Pin
Power Supply Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
DQ Pin
Type
Function (In Detail)
A0 to A10 are address inputs. A0-A10 are used as row address inputs during active
command input and A0-A7 as column address inputs during read or write command input.
A10 is also used to determine the precharge mode during other commands. If A10 is
LOW during precharge command, the bank selected by A11 is precharged, but if A10 is
HIGH, both banks will be precharged.
When A10 is HIGH in read or write command cycle, the precharge starts automatically
after the burst access.
These signals become part of the OP CODE during mode register set command input.
A11 is the bank selection signal. When A11 is LOW, bank 0 is selected and when high,
bank 1 is selected. This signal becomes part of the OP CODE during mode register set
command input.
CAS, in conjunction with the RAS and WE, forms the device command. See the
“Command Truth Table” item for details on device commands.
The CKE input determines whether the CLK input is enabled within the device. When is
CKE HIGH, the next rising edge of the CLK signal will be valid, and when LOW, invalid.
When CKE is LOW, the device will be in either the power-down mode, the clock suspend
mode, or the self refresh mode. The CKE is an asynchronous input.
CLK is the master clock input for this device. Except for CKE, all inputs to this device are
acquired in synchronization with the rising edge of this pin.
The CS input determines whether command input is enabled within the device.
Command input is enabled when CS is LOW, and disabled with CS is HIGH. The device
remains in the previous state when CS is HIGH.
DQ0 to DQ15 are DQ pins. DQ through these pins can be controlled in byte units
using the LDQM and UDQM pins.
LDQM and UDQM control the lower and upper bytes of the DQ buffers. In read
mode, LDQM and UDQM control the output buffer. When LDQM or UDQM is LOW, the
corresponding buffer byte is enabled, and when HIGH, disabled. The outputs go
the HIGH impedance state when LDQM/UDQM is HIGH. This function corresponds to OE
in conventional DRAMs. In write mode, LDQM and UDQM control the input buffer. When
LDQM or UDQM is LOW, the corresponding buffer byte is enabled, and data can be
written to the device. When LDQM or UDQM is HIGH, input data is masked and cannot be
written to the device.
RAS, in conjunction with CAS and WE, forms the device command. See the “Command
Truth Table” item for details on device commands.
Truth Table” item for details on device commands.
VDDQ is the output buffer power supply.
VDD is the device internal power supply.
GNDQ is the output buffer ground.
GND is the device internal ground.
WE, in conjunction with RAS and CAS, forms the device command. See the “Command
Integrated Silicon Solution, Inc. — www.issi.com
05/18/2010
Rev. E
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