SSTU32864EC/G,551 NXP Semiconductors, SSTU32864EC/G,551 Datasheet - Page 18

• Manufacturer Part Number: SSTU32864EC/G,551
• Description: IC BUFFER 1.8V 25BIT SOT536-1
• Manufacturer: NXP Semiconductors

Specifications of SSTU32864EC/G,551

• Logic Type: 1:1, 1:2 Configurable Registered Buffer
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Logic Family: SSTU
• Logical Function: Registered Buffer
• Number Of Elements: 1
• Number Of Inputs: 25
• Number Of Outputs: 25
• High Level Output Current: -8mA
• Low Level Output Current: 8mA
• Propagation Delay Time: 3ns
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Clock-edge Trigger Type: Posit/Negat-Edge
• Polarity: Non-Inverting
• Technology: CMOS
• Frequency (max): 450(Min)MHz
• Mounting: Surface Mount
• Pin Count: 96
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935275429551; SSTU32864EC/G-S; SSTU32864EC/G-S

Philips Semiconductors
13. Abbreviations
9397 750 14092
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 11:
Acronym
CMOS
DDR
DIMM
JEDEC
LFBGA
LVCMOS
PRR
RDIMM
SSTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Complementary Metal Oxide Silicon
Double Data Rate
Dual In-line Memory Module
Joint Electron Device Engineering Council
Low profile Fine-pitch Ball Grid Array
Low Voltage Complementary Metal Oxide Silicon
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
1.8 V configurable registered buffer for DDR2 RDIMM applications
Rev. 02 — 22 October 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SSTU32864
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