STM32F215RGT6TR STMicroelectronics, STM32F215RGT6TR Datasheet - Page 151
STM32F215RGT6TR
Manufacturer Part Number
STM32F215RGT6TR
Description
ARM Microcontrollers - MCU STM32F21 High-Perf M3 1Mb 120 MHz MCU
Manufacturer
STMicroelectronics
Datasheet
1.STM32F217VGT6TR.pdf
(173 pages)
Specifications of STM32F215RGT6TR
Product Category
ARM Microcontrollers - MCU
Core
ARM Cortex M3
Data Bus Width
32 bit
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STM32F21xxx
6.2
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 89.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP176 - 24 × 24 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA176 - 10× 10 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 17050 Rev 8
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Value
Package characteristics
38
45
46
40
39
max + P
I/O
max),
°C/W
Unit
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