MT48H4M16LFB4-8:H Micron Technology Inc, MT48H4M16LFB4-8:H Datasheet - Page 62

• Manufacturer Part Number: MT48H4M16LFB4-8:H
• Description: IC SDRAM 64MBIT 125MHZ 54VFBGA
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48H4M16LFB4-8:H

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 64M (4M x 16)
• Speed: 125MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-VFBGA
• Organization: 4Mx16
• Density: 64Mb
• Address Bus: 14b
• Access Time (max): 8/6ns
• Maximum Clock Rate: 125MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 50mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 49:
PDF: 09005aef8237ed98/Source: 09005aef8237ed68
64mb_x16_Mobile SDRAM_Y24L_2.fm - Rev. C 10/07 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
Solder ball diameter
refers to post-reflow
condition. The pre-reflow
diameter is 0.42.
for production devices. Although considered final, these specifications are subject to change, as further product
Seating plane
54X Ø0.45 ±0.05
6.40
54-Ball VFBGA (8mm x 8mm)
3.20 ±0.05
0.10 C
Ball A9
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
0.65 ±0.05
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions are in millimeters.
3.20 ±0.05
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
their respective owners.
0.80 TYP
C L
Ball A1
Ball A1 ID
4.00 ±0.05
62
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
64Mb: 4 Meg x 16 Mobile SDRAM
1.00 MAX
Solder ball material: 96.5% Sn, 3% Ag, 0.5% CU
Solder mask defined ball pads: Ø0.40
Substrate material: Plastic laminate
Mold compound: Epoxy novolac
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID