PBSS5160V T/R NXP Semiconductors, PBSS5160V T/R Datasheet
PBSS5160V T/R
Specifications of PBSS5160V T/R
Related parts for PBSS5160V T/R
PBSS5160V T/R Summary of contents
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... NPN complement: PBSS4160V. 1.2 Features Low collector-emitter saturation voltage V High collector current capability I High efficiency leading to less heat generation Reduces printed-circuit board area required Cost effective replacement for medium power transistors BCP52 and BCX52 1.3 Applications Major application segments Automotive Telecom infrastructure Industrial ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package PBSS5160V 4. Marking Table 4. Type number PBSS5160V 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO ...
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... NXP Semiconductors [1] Device mounted on a FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on a FR4 PCB, single-sided copper, tin-plated (1) FR4 PCB (2) FR4 PCB; standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on a FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors (1) th (K/W) (2) (3) ( (5) (6) (7) (8) 10 (9) (10) 1 −1 10 −5 − Mounted on FR4 PCB; standard footprint (1) δ (2) δ = 0.75 (3) δ = 0.5 (4) δ = 0.33 (5) δ = 0.2 (6) δ = 0.1 (7) δ = 0.05 (8) δ = 0.02 (9) δ = 0.01 (10) δ Fig 2. Transient thermal impedance as a function of pulse time; typical values ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics ° unless otherwise specified. amb Symbol Parameter I collector-base cut-off current CBO I collector-emitter cut-off current CES I emitter-base cut-off current EBO h DC current gain FE V collector-emitter saturation CEsat voltage V base-emitter saturation voltage BEsat R equivalent on-resistance CEsat V base-emitter turn-on voltage ...
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... NXP Semiconductors 600 h FE (1) 400 (2) 200 (3) 0 −1 −10 −1 −10 −10 = − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 3. DC current gain as a function of collector current; typical values −10 V CEsat (V) −1 −1 −10 (1) (2) (3) − ...
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... NXP Semiconductors −1.2 V BEsat (V) (1) −0.8 (2) (3) −0.4 0 −1 −10 −1 −10 − −55 °C (1) T amb = 25 °C (2) T amb = 100 °C (3) T amb Fig 7. Base-emitter saturation voltage as a function of collector current; typical values PBSS5160V_3 Product data sheet 001aaa722 − ...
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... NXP Semiconductors −2 (5) ( (A) −1.6 −1.2 −0.8 −0.4 0 −1 −2 − °C T amb = − − − − − − − − − − ...
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... NXP Semiconductors − − Fig 11. BISS transistor switching time definition oscilloscope = − −0 Bon Fig 12. Test circuit for switching times PBSS5160V_3 Product data sheet (probe) o 450 Ω ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions) UNIT 0.6 0.27 0.18 1.7 mm 0.5 0.17 0.08 1.5 OUTLINE VERSION IEC SOT666 Fig 13. Package outline SOT666 PBSS5160V_3 Product data sheet ...
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... NXP Semiconductors 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBSS5160V SOT666 [1] For further information and the availability of packing methods, see PBSS5160V_3 Product data sheet [1] Description 4 mm pitch tape and reel Section 12 ...
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... Table 9. Revision history Document ID Release date PBSS5160V_3 20091214 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 13 “Package outline PBSS5160V_2 20050404 PBSS5160V_1 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Packing information . . . . . . . . . . . . . . . . . . . . 11 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Legal information 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 11 ...