MT29F2G08ABAEAWP-IT:E Micron Technology Inc, MT29F2G08ABAEAWP-IT:E Datasheet - Page 14

• Manufacturer Part Number: MT29F2G08ABAEAWP-IT:E
• Description: IC FLASH 2G 3.3V 2KBPG 48TSOP
• Manufacturer: Micron Technology Inc

Specifications of MT29F2G08ABAEAWP-IT:E

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / Rohs Status: Compliant

Figure 7: 63-Ball VFBGA (9mm x 11mm)
PDF: 09005aef83b83f42
m69a_2gb_nand.pdf – Rev. H 09/10 EN
Seating
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.4
SMD ball pads.
plane
8.8 CTR
0.12 A
63X Ø0.45
0.8 TYP
A
Note:
10 9
1. All dimensions are in millimeters.
8
7
7.2 CTR
9 ±0.1
6
0.8 TYP
5
4
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
11 ±0.1
14
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x8, x16 NAND Flash Memory
0.25 MIN
1.0 MAX
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.
Ball A1 ID