MT47H64M8CB-3:B Micron Technology Inc, MT47H64M8CB-3:B Datasheet - Page 62

IC DDR2 SDRAM 512MBIT 3NS 60FBGA

MT47H64M8CB-3:B

Manufacturer Part Number
MT47H64M8CB-3:B
Description
IC DDR2 SDRAM 512MBIT 3NS 60FBGA
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT47H64M8CB-3:B

Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
512M (64M x 8)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H64M8CB-3:B
Manufacturer:
MICRON
Quantity:
12 388
Part Number:
MT47H64M8CB-3:B
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H64M8CB-3:B TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 43:
PDF: 09005aef8117c18e, Source: 09005aef8211b2e6
512MbDDR2_2.fm - Rev. K 8/06 EN
COMMAND 5
ADDRESS
DQS#,
ODT 8
CKE 1
DQS
CK#
CK 1
DM
DQ
Self Refresh
t AOFD / t AOFPD 8
NOP
t RP 2
T0
Notes:
t CH
Enter self refresh
mode (synchronous)
t CL
10. CKE must stay HIGH until
11. Once exiting SELF REFRESH, ODT must remain LOW until
1. Clock must be stable and meeting
2. Device must be in the all banks idle state prior to entering self refresh mode.
3.
4.
5. REF = REFRESH command.
6. Self refresh exit is asynchronous; however,
7. NOP or DESELECT commands are required prior to exiting self refresh until state Tc0, which
8. ODT must be disabled and R
9. Once self refresh has been entered,
REF
T1
refresh mode and at least 1 x
t
t
clock edge where CKE HIGH satisfies
allows any non-READ command.
SELF REFRESH at state T1.
go back LOW after
XSNR is required before any non-READ command can be applied.
XSRD (200 cycles of CK) is required before a READ command can be applied at state Td0.
t CK 1
T2
t CKE (MIN)
t
XSNR is satisfied.
Ta0
9
t
XSRD is met; however, if self refresh is being re-entered, CKE may
t CK 1
TT
62
t
CK prior to exiting self refresh mode.
off (
Exit self refresh
mode (asynchronous)
Ta1
t
t
CK specifications at least 1 x
AOFD and
t
CKE (MIN) must be satisfied prior to exiting self refresh.
t
ISXR.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t ISXR 6
NOP 7
t
XSNR and
Ta2
512Mb: x4, x8, x16 DDR2 SDRAM
t
AOFPD have been satisfied) prior to entering
t CKE 10
t XSNR 3, 6, 11
t
XSRD timing starts at the first rising
NOP 7
t
Tb0
XSRD is satisfied.
t XSRD 4,6
DON’T CARE
©2004 Micron Technology, Inc. All rights reserved.
t
CK after entering self
VALID 3
VALID
Tc0
Self Refresh
Indicates a break in
time scale
VALID 4
VALID 3
Td0
t IH
t IH

Related parts for MT47H64M8CB-3:B