MT48H16M32LFCM-75 IT:A TR Micron Technology Inc, MT48H16M32LFCM-75 IT:A TR Datasheet - Page 72

• Manufacturer Part Number: MT48H16M32LFCM-75 IT:A TR
• Description: IC SDRAM 512MBIT 133MHZ 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M32LFCM-75 IT:A TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 8/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 95mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1329-2

Package Dimensions
Figure 55:
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. J 2/08 EN
Dimensions
apply to solder
balls post reflow.
Pre-reflow balls
are Ø0.42 on
Ø0.40 SMD ball
pads.
Seating
0.1 A
54X Ø0.45
6.4
plane
0.8 TYP
0.8 TYP
3.2
54-Ball VFBGA (10mm x 11.5mm)
A
Notes:
9
8
1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
7
10 ±0.10
6.4
3.2
3
5 ±0.05
2
1
A
B
C
D
E
F
G
H
J
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Ball A1 ID
5.75 ±0.05
0.65 ±0.05
72
11.5 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID